LED chip scale package has no obvious performance advantages

Why is LED no-package technology attracting attention, and even some traditional packaging companies are worried about being killed? What areas does it mainly apply to? How large will the market size in the future be? First come to popularize a concept, the so-called unpackaged or package-free package is actually a chip-scale package, that is, flip-chip directly sealed to the bottom of the package pad, no gold wire, no bracket, simplify the production process, reduce production costs, The package size can be made smaller, while the same package size provides more power. As the originator of chip-scale packaging, the interpretation of Epistar is perhaps more reliable. Epistar Optoelectronics Lin Yida bluntly, chip-level packaging is not without packaging, it seems that there is no way to avoid packaging, so it is impossible to eliminate the life of traditional packaging, and from the development of the LED industry, there is no package Technology completely replaces another packaging technology. According to Lin Tie, director of marketing for CREE China, the cost advantage that chip-level packaging has always claimed is not much convincing. Instead, it sacrifices the simplicity of the original mature process and puts the packaging process ahead of time. In the process of chip fabrication, the difficulty of making the chip is increased, which is not conducive to the yield of the product. The original production equipment becomes unsuitable, the purchase cost of the new equipment is increased, and the new process is explored. Then, the technical requirements for the production line workers are higher, and the training cost is increased. In terms of current products, chip-level packaging has no obvious performance advantages. Why do chip-level packaging, the final point is how much lumens can be bought for 1 dollar or 1 yuan. I think the chip-scale package will take the flip chip process one step further and become smaller and cheaper. This year's flip chip is more popular and more convenient to use, and is closer to the SMD package. Mo Qingwei, vice president of the LED chip business unit of Dehao Runda, clearly expressed optimism. The chip-scale package can achieve a very large illumination angle. In the laboratory example, the fluorescent tube is replaced by a chip-scale package, which avoids the black area caused by the narrow angle of the ordinary light. From the perspective of the application side, no matter which technology, the most important thing is to look at the price/performance ratio. Ou Shilan LED expert Liang Yuhua believes that the current price of chip-level package products or systems has no obvious advantages, even more expensive than traditional packaging technology. The advantage is that it is smaller and denser, and it is used in some areas with high light efficiency and high density. Li Kun cone, director of the chip-level packaging market, said that because of the large-scale advantages of chip-level packaging, there will be some alternative markets in the past two years, and the market share will probably be 10. In the lighting market, most commercial lighting is still dominated by small and medium power, while chip-level packaging is mainly concentrated in high power. Whether it is necessary to go into chip-level packaging for small and medium power is still open to question. Ou Slang LED expert Liang Yuhua said that in the future, the ratio of medium to small power will exceed 60 or higher, while the medium power or COB will drop to 40, and the high power will only account for 20. The high power field only has a part to replace the non-package technology. It is around 10. In the field of TV backlighting, there are currently 37 brands and millions of fist products of a certain brand. The number of devices required is about 32 to 37, which is the demand of dozens of KK. . Compared to the total lighting market and packaging market, the proportion of chip-level packaging is still very small. Lin Yida also gave his own answer.

Optical Element

Coupletech Co., Ltd supplies a variety of high quality optical components: optical material, lenses, windows, mirror, prisms, filter, IPL - filter. Optical material is including BK7, Fused silica, quartz, CaF2, MgF2, BaF2, Sapphire, ZnSe, a-BBO, LiNbO3, Calcite, and so on. Lens is including Plano Convex Spherical Lens, Double Convex Spherical Lens, Plano Concave Spherical Lens, Double Concave Spherical Lens, Meniscus Spherical Lens, Ball Lens, Rod Lens, Plano Convex Cylindrical Lens and Plano Concave Cylindrical Lens, Achromatic lens and so on. Windows are optical glass with polished faces that are relatively parallel. They are used to protect laser output. Always windows are AR coated, HR coated or PR coated. Mirrors is including Dielectric laser line mirror, Metal coated mirror, Right angle prism mirror, Output coupler, harmonic separator. Prisms are including Right angle prism, Dove prism, Porro prism, Brewster prism, Roof prism and wedge prism. Filter is inclusing Color glass filter, Interference Bandpass filter, Neutral Density Filter-Absorptive and Neutral Density Filter-Reflective.

Coupletech supplies many kinds of Optical elements with different materials.

Optical Elements,Optical Lenses,Optical Filters,Optical Windows,Optical Mirrors,Optical prisms,ZnSe windows

Coupletech Co., Ltd. , https://www.coupletech.com