The 48th Research Institute of China Electronics Technology Group Co., Ltd. has successfully developed the country's first chemical mechanical polishing (CMP) equipment with independent intellectual property rights, specifically designed for 0.25μm device feature sizes and 6-inch to 8-inch wafer flattening processes. This breakthrough marks a significant milestone in China's semiconductor manufacturing industry.
This achievement fills a critical gap in the domestic IC equipment sector, where previously such advanced CMP systems were dominated by foreign manufacturers. The successful development of this technology not only enhances China’s self-reliance in key microelectronics manufacturing tools but also lays a solid foundation for the leapfrog development of the national microelectronics industry.
By establishing an independent R&D system and improving the overall technical level of integrated circuits, this project contributes significantly to strengthening the core competitiveness of China’s semiconductor industry. It also plays a vital role in breaking the technological monopoly held by foreign companies, promoting the localization of high-end manufacturing equipment and supporting the long-term sustainable development of the domestic electronics sector.
With this advancement, China is taking a stronger step toward achieving technological independence in the global semiconductor landscape.
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