The 48th Research Institute of China Electronics Technology Group Co., Ltd. has successfully developed the country's first chemical mechanical polishing (CMP) equipment with independent intellectual property rights, specifically designed to meet the requirements for 0.25μm device feature sizes and 6-inch to 8-inch wafer flattening processes. This breakthrough marks a significant milestone in China’s semiconductor manufacturing industry.
This achievement fills a critical gap in the domestic IC equipment sector, where high-precision CMP technology was previously dominated by foreign manufacturers. By developing this advanced equipment, the institute has not only enhanced China’s self-reliance in microelectronics but also laid a solid foundation for the future development of the industry.
The successful R&D of this project represents a major step forward in improving the overall technical level of China’s integrated circuit industry. It strengthens the country’s core competitiveness and paves the way for breaking the technological monopoly held by international players. With this innovation, China is moving closer to achieving long-term, sustainable growth in its semiconductor sector, reducing dependency on imported technologies, and fostering a more resilient and independent industrial ecosystem.
This development is not just a technical success, but also a strategic one, signaling China’s growing capability to lead in key areas of high-tech manufacturing. The project highlights the importance of continuous investment in research and development, as well as the value of cultivating local expertise in cutting-edge technologies.
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